THE Intel announced on Wednesday (9) the new series of Xeon Max processors equipped with high-speed onboard HBM2e memory. The chips are designed for high-performance server systems.
According to the manufacturer, the processors offer up to 56 cores with support for up to 112 virtual threads and have a TDP of 350W. Intel also stated that the Xeon Max line is the world’s first with onboard HBM.
The new Xeon Max processors use the EMIB interface, formed by four arrays with compute cores, in addition to 64 GB of HBM2e memory located side by side on the same substratedivided into four clusters of 16 GB each.
Also according to Intel, the total transfer rate of the chips is about 1 TB/s. Xeon Max supports PCIe 5.0 and CXL 1.1 interfaces. Another difference is that the HBM2e memory can be used as additional cache and additional RAM.
The manufacturer claimed that the power consumption of Xeon Max is 68% lower than AMD Milan-X processors with the same performance and up to five times faster in some operations than Intel Xeon 8380 or AMD EPYC 7773X.
Support for the new AMX instructions in Xeon Max accelerates AI tasks and offers up to eight times the maximum performance of AVX-512 instructions in INT8 and INT32 operations. The Xeon Max series for servers will hit the market in January 2023.
It is worth noting that the The Xeon Max family’s main competitor is the AMD EPYC Genoa line of processors, which will be presented at an event scheduled for tomorrow, Thursday (10)🇧🇷 The rival should also present chips with HBM memory.
