Realme GT Neo 3 ever closer: Dimensity 8100 and the other news from the rumors

There are just a few days left until the presentation of Realme GT 3 Neo, the new smartphone from Realme that promises to introduce one of the fastest fast recharges on the market with its 150 W of power, but it doesn’t seem to end there. The latest rumors allow us to draw an even more complete picture of the specifications, starting with the equipped SoC.


The latest news on this comes through two teasers shared by Realme itself who anticipate that the SoC chosen for GT Neo 3 is the new one MediaTek Dimensity 8100 recently announced, a mid-to-high-end chip a 5nm which guarantees excellent performance on the CPU side and promises to also offer a good gaming experience thanks to its GPU Mali-G610 MC6. Performance that should also be supported by the presence of internal type memories UFS 3.1therefore able to always be fast and reactive in every usage scenario.

So if the SoC seems to be promising, it is equally interesting to see how Realme seems to have also paid attention to the management of the display, since the second teaser confirms the presence of a proprietary chip dedicated to the screen, in order to ensure better performance and lower energy consumption. Recall that GT Neo 3 should be equipped with a 6.7 “AMOLED type with FullHD + resolution and hole for the camera (16 MP), in addition to the inevitable high refresh rate which should be positioned at 120 Hz.

Among the other features that emerged in recent weeks there is also the presence of a triple rear camera with main sensor from 50 MegaPixel (Sony IMX766), flanked by an 8 MP ultra wide-angle and a 2 MP macro as inevitable as it is useless. The battery should be a unit of 4,500 mAh able to recharge from 0 to 100% in just 5 minutes thanks to the aforementioned 150 W recharge. Now we just have to wait for the Chinese presentation set for March 22.