Intel only manufactures one of four chiplets and the interposer for the CPU generation Core i-14000 itself. Most of the logic comes from chip order manufacturer TSMC.
Intel relies largely on the expertise of the chip order manufacturer TSMC for its processor series Meteor Lake. The CPU consists of four chiplets – called tiles by Intel – of which TSMC produces three pieces: the GPU, the I/O tile and the SoC part, which, among other things, should distribute the data to the neighboring chiplets.
Intel manufactures the compute tile with the CPU cores itself in the process called Intel 4. Since only the successor process Intel 3 brings the extensions necessary for GPUs and other logic blocks, almost all other parts come from TSMC.
Intel also manufactures the passive silicon interposer itself. It sits below the tiles and connects them using through-silicon vias (TSVs), but does not contain any logic of its own. At the Hot Chips Conference, Intel confirmed that the Imposer will be made with 22 nanometer technology, now called Intel 16.
Probably not 3 nm technology from TSMC
Intel did not comment on the TSMC processes used. However, the two websites Tom’s Hardware and PC Watch independently report that Intel has its chiplets manufactured with structures of 6 and 5 nm: the I/O and SoC tiles in the so-called N6 process, the GPU in N5.
Meanwhile, Intel reiterated that there should never have been a change in the manufacturing process for the GPU. This was also reported in advance by the Semiaccurate website, which invalidated rumors of a postponement of the Meteor Lake CPU generation in connection with the TSMC 3 nm process N3. The processors of the Core i-14000 series should therefore appear at the end of 2023 as usual.